Invention Grant
US08398466B2 CMP pad conditioners with mosaic abrasive segments and associated methods
有权
具有马赛克磨料段的CMP垫调节器和相关方法
- Patent Title: CMP pad conditioners with mosaic abrasive segments and associated methods
- Patent Title (中): 具有马赛克磨料段的CMP垫调节器和相关方法
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Application No.: US12168110Application Date: 2008-07-05
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Publication No.: US08398466B2Publication Date: 2013-03-19
- Inventor: Chien-Min Sung , Michael Sung
- Applicant: Chien-Min Sung , Michael Sung
- Agency: Thorpe North & Western LLP
- Main IPC: B24B53/02
- IPC: B24B53/02
Abstract:
A CMP pad conditioner comprises a plurality of abrasive segments. Each abrasive segment includes a segment blank and an abrasive layer attached to the segment blank, the abrasive layer including a superhard abrasive material. A pad conditioner substrate is also provided. Each of the plurality of abrasive segments is permanently affixed to the pad conditioner substrate in an orientation that enables removal of material from a CMP pad by the abrasive layer as the pad conditioner and the CMP pad are moved relative to one another.
Public/Granted literature
- US20090068937A1 CMP Pad Conditioners with Mosaic Abrasive Segments and Associated Methods Public/Granted day:2009-03-12
Information query
