Invention Grant
- Patent Title: Light exposure apparatus and manufacturing method of semiconductor device using the same
- Patent Title (中): 曝光装置及使用其的半导体装置的制造方法
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Application No.: US12757063Application Date: 2010-04-09
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Publication No.: US08398725B2Publication Date: 2013-03-19
- Inventor: Koichiro Tanaka , Yoshiaki Yamamoto
- Applicant: Koichiro Tanaka , Yoshiaki Yamamoto
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office, P.C.
- Agent Eric J. Robinson
- Priority: JP2004-375080 20041224
- Main IPC: H01L21/027
- IPC: H01L21/027 ; H01L21/66

Abstract:
When annealing of a semiconductor film is conducted using a plurality of lasers, each of the distances between laser irradiation regions is different. When a lithography step is conducted in accordance with a marker which is formed over a substrate in advance after the step, light-exposure is not correctly conducted to a portion crystallized by laser. By using a laser irradiation region obtained on a laser irradiation step as a marker, light-exposure is conducted by making a light-exposure position of a stepper coincide with a large grain size region in the laser irradiation region. A large grain size region and a poorly crystalline region are detected by utilizing a thing that scattering intensity of light is different between the large grain size region and the poorly crystalline region, thereby determining a light-exposure position.
Public/Granted literature
- US20100207040A1 LIGHT EXPOSURE APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME Public/Granted day:2010-08-19
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