Invention Grant
- Patent Title: Transfer film and method for fabricating a circuit
- Patent Title (中): 转印膜和制造电路的方法
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Application No.: US12277391Application Date: 2008-11-25
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Publication No.: US08398869B2Publication Date: 2013-03-19
- Inventor: Paul Attridge , Foster P. Lamm
- Applicant: Paul Attridge , Foster P. Lamm
- Applicant Address: US CT Stratford
- Assignee: Sikorsky Aircraft Corporation
- Current Assignee: Sikorsky Aircraft Corporation
- Current Assignee Address: US CT Stratford
- Agency: Carlson, Gaskey & Olds PC
- Main IPC: H01B13/00
- IPC: H01B13/00 ; C23F1/02
Abstract:
A method of fabricating a circuit includes bonding an electrically conductive layer to a carrier film using an adhesive selected from acrylic polymer and silicone polymer, removing selected portions of the electrically conductive layer from the carrier film to provide a circuit arrangement, and transferring the circuit arrangement from the carrier film to a substrate.
Public/Granted literature
- US20100126958A1 TRANSFER FILM AND METHOD FOR FABRICATING A CIRCUIT Public/Granted day:2010-05-27
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