Provided is a process for preparing surface-modified silicon dioxide particles with a mean particle diameter of at most 100 nm, involving (A) high-pressure grinding of a predispersion having (i) surface-modified silicon dioxide particles which are at least partly aggregated, are bonded to the surface-modifying component via Si—O—Si bonds, and still have reactive groups on their surface; (ii) an organosilicon compound which has a silicon-carbon bond and a functional group which can react with the reactive groups to form a covalent Si—O—Si bond; and (iii) a solvent, to form a dispersion; and (B) removing the liquid phase of the dispersion. Also provided are redispersible, surface-modified silicon dioxide particles obtained by this process, and their use in toner powders, silicone rubber, adhesives, and scratch-resistance surface coatings.