Invention Grant
- Patent Title: Lithography mask having sub-resolution phased assist features
- Patent Title (中): 平版印刷掩模具有次分辨率分阶段辅助功能
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Application No.: US12977813Application Date: 2010-12-23
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Publication No.: US08399157B2Publication Date: 2013-03-19
- Inventor: Shem O. Ogadhoh
- Applicant: Shem O. Ogadhoh
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Finch & Maloney PLLC
- Main IPC: G03F1/36
- IPC: G03F1/36

Abstract:
Techniques are disclosed for using sub-resolution phased assist features (SPAF) in a lithography mask to improve through process pattern fidelity and/or mitigate inverted aerial image problems. The technique also may be used to improve image contrast in non-inverted weak image sites. The use of SPAF in accordance with some such embodiments requires no adjustment to existing design rules, although adjustments can be made to enable compliance with mask inspection constraints. The use of SPAF also does not require changing existing fab or manufacturing processes, especially if such processes already comprehend phased shift mask capabilities. The SPAFs can be used to enhance aerial image contrast, without the SPAFs themselves printing.
Public/Granted literature
- US20120164562A1 LITHOGRAPHY MASK HAVING SUB-RESOLUTION PHASED ASSIST FEATURES Public/Granted day:2012-06-28
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