Invention Grant
- Patent Title: Alignment inspection
- Patent Title (中): 校准检查
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Application No.: US12957169Application Date: 2010-11-30
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Publication No.: US08399264B2Publication Date: 2013-03-19
- Inventor: Zhihua Zou , Liang Zhang , Sheng Li , Tamil Selvamuniandy
- Applicant: Zhihua Zou , Liang Zhang , Sheng Li , Tamil Selvamuniandy
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Winkle, PLLC
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/66 ; H01L21/44 ; H01L23/58 ; G01R31/26
Abstract:
The present disclosure relates to the field of microelectronic substrate fabrication and, more particularly, to alignment inspection for vias formed in the microelectronic substrates. The alignment inspection may be achieved by determining the relative positions of fluorescing and non-fluorescing elements in a microelectronic substrate.
Public/Granted literature
- US20120135546A1 ALIGNMENT INSPECTION Public/Granted day:2012-05-31
Information query
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