Invention Grant
US08399266B2 Test structure for detection of gap in conductive layer of multilayer gate stack
有权
用于检测多层栅极叠层导电层间隙的测试结构
- Patent Title: Test structure for detection of gap in conductive layer of multilayer gate stack
- Patent Title (中): 用于检测多层栅极叠层导电层间隙的测试结构
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Application No.: US13013133Application Date: 2011-01-25
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Publication No.: US08399266B2Publication Date: 2013-03-19
- Inventor: Renee T. Mo , Oliver D. Patterson , Xing Zhou
- Applicant: Renee T. Mo , Oliver D. Patterson , Xing Zhou
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Ian MacKinnon
- Main IPC: G01R31/26
- IPC: G01R31/26

Abstract:
A semiconductor structure including a test structure for detection of a gap in a conductive layer of the semiconductor structure includes a semiconductor substrate; the test structure, the test structure being located on the semiconductor substrate, the test structure comprising a multilayer gate stack, wherein the multilayer gate stack includes a single conductive layer region including: a gate dielectric located on the semiconductor substrate; the conductive layer located on the gate dielectric; and an undoped amorphous silicon layer located on the conductive layer; and wherein the test structure is configured to detect the presence of the gap in the conductive layer.
Public/Granted literature
- US20120187400A1 TEST STRUCTURE FOR DETECTION OF GAP IN CONDUCTIVE LAYER OF MULTILAYER GATE STACK Public/Granted day:2012-07-26
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