Invention Grant
- Patent Title: Method for packaging electronic devices and integrated circuits
- Patent Title (中): 包装电子设备和集成电路的方法
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Application No.: US13231844Application Date: 2011-09-13
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Publication No.: US08399293B2Publication Date: 2013-03-19
- Inventor: Juergen Leib , Hidefumi Yamamoto
- Applicant: Juergen Leib , Hidefumi Yamamoto
- Applicant Address: US CA Cupertino
- Assignee: Wafer-Level Packaging Portfolio LLC
- Current Assignee: Wafer-Level Packaging Portfolio LLC
- Current Assignee Address: US CA Cupertino
- Agent Edward P. Heller, III
- Priority: DE102006032925 20060715
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/495
Abstract:
The present invention relates to the field of electronic devices and their associated driver and/or controller integrated circuits and in particular to the mechanical packaging of electronic devices and to the packaging of electronic devices and their associated driver and/or controller integrated circuits.
Public/Granted literature
- US20120003791A1 Method for Packaging Electronic Devices and Integrated Circuits Public/Granted day:2012-01-05
Information query
IPC分类:
