Invention Grant
- Patent Title: Airgap micro-spring interconnect with bonded underfill seal
- Patent Title (中): 气隙微弹簧互连带粘合底部填充密封
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Application No.: US13269609Application Date: 2011-10-09
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Publication No.: US08399296B2Publication Date: 2013-03-19
- Inventor: Christopher L. Chua , Bowen Cheng , Eugene M. Chow , Dirk De Bruyker
- Applicant: Christopher L. Chua , Bowen Cheng , Eugene M. Chow , Dirk De Bruyker
- Applicant Address: US CA Palo Alto
- Assignee: Palo Alto Research Center Incorporated
- Current Assignee: Palo Alto Research Center Incorporated
- Current Assignee Address: US CA Palo Alto
- Agency: Marger Johnson & McCollom PC
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/34
Abstract:
A method of assembling a package includes aligning a pad chip with a spring chip to form at least one interconnect in an interconnect area, adhering the pad chip to the spring chip so that there is a gap between the pad chip and the spring chip, dispensing underfill material into the gap to seal the interconnect area from an environment external to the package, and curing the underfill material to form a solid mold.
Public/Granted literature
- US20120088330A1 AIRGAP MICRO-SPRING INTERCONNECT WITH BONDED UNDERFILL SEAL Public/Granted day:2012-04-12
Information query
IPC分类:
