Invention Grant
US08399298B2 Rule-based semiconductor die stacking and bonding within a multi-die package
有权
基于规则的半导体管芯堆叠和多芯片封装内的接合
- Patent Title: Rule-based semiconductor die stacking and bonding within a multi-die package
- Patent Title (中): 基于规则的半导体管芯堆叠和多芯片封装内的接合
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Application No.: US13445671Application Date: 2012-04-12
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Publication No.: US08399298B2Publication Date: 2013-03-19
- Inventor: Charles Hung-Hsiang Wu
- Applicant: Charles Hung-Hsiang Wu
- Applicant Address: US TX Plano
- Assignee: SanDisk Technologies Inc.
- Current Assignee: SanDisk Technologies Inc.
- Current Assignee Address: US TX Plano
- Agency: Vierra Magen Marcus LLP
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A rule-based method of optimizing wire bonding jumps is disclosed which minimizes the amount of wire used for wire bonds and/or minimizes a number of power and ground pads on a substrate to support all wired connections.
Public/Granted literature
- US20120196403A1 Rule-Based Semiconductor Die Stacking And Bonding Within A Multi-Die Package Public/Granted day:2012-08-02
Information query
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