Invention Grant
- Patent Title: Methods of forming radiation-hardened semiconductor structures
- Patent Title (中): 形成辐射硬化半导体结构的方法
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Application No.: US12844684Application Date: 2010-07-27
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Publication No.: US08399312B2Publication Date: 2013-03-19
- Inventor: John S. Canham
- Applicant: John S. Canham
- Applicant Address: US VA Arlington
- Assignee: Alliant Techsystems Inc.
- Current Assignee: Alliant Techsystems Inc.
- Current Assignee Address: US VA Arlington
- Agency: TraskBritt
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A radiation-hardened semiconductor structure including an insulator material doped with at least one of a transition metal, a lanthanide, and an actinide, and a semiconductor material located over the insulator material. A semiconductor device including the radiation-hardened semiconductor structure is also disclosed, as are methods of forming the radiation-hardened semiconductor structure and the semiconductor device.
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