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US08399319B2 Semiconductor device and method for manufacturing the same 有权
半导体装置及其制造方法

  • Patent Title: Semiconductor device and method for manufacturing the same
  • Patent Title (中): 半导体装置及其制造方法
  • Application No.: US12839291
    Application Date: 2010-07-19
  • Publication No.: US08399319B2
    Publication Date: 2013-03-19
  • Inventor: Sang Soo Lee
  • Applicant: Sang Soo Lee
  • Applicant Address: KR Icheon-Si
  • Assignee: Hynix Semiconductor Inc.
  • Current Assignee: Hynix Semiconductor Inc.
  • Current Assignee Address: KR Icheon-Si
  • Priority: KR10-2010-0036936 20100421
  • Main IPC: H01L21/00
  • IPC: H01L21/00
Semiconductor device and method for manufacturing the same
Abstract:
A semiconductor device includes a substrate and a plurality of unit cells vertically arranged on the substrate.
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