Invention Grant
- Patent Title: Integrated circuits and methods of forming conductive lines and conductive pads therefor
- Patent Title (中): 集成电路和形成导线及其导电焊盘的方法
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Application No.: US12861093Application Date: 2010-08-23
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Publication No.: US08399347B2Publication Date: 2013-03-19
- Inventor: Roger W Lindsay
- Applicant: Roger W Lindsay
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Leffert Jay & Polglaze, P.A.
- Main IPC: H01L21/426
- IPC: H01L21/426
Abstract:
Integrated circuits and methods for forming conductive lines and conductive pads of integrated circuits are disclosed. One such integrated circuit includes circuitry, a first conductor coupled to the circuitry, a conductive pad coupled to the first conductor, and a second conductor spaced apart from the first conductor and coupled to the conductive pad. The second conductor would be floating but for its coupling to the conductive pad.
Public/Granted literature
- US20120043661A1 INTEGRATED CIRCUITS AND METHODS OF FORMING CONDUCTIVE LINES AND CONDUCTIVE PADS THEREFOR Public/Granted day:2012-02-23
Information query
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