Invention Grant
- Patent Title: Methods of forming titanium silicon oxide
- Patent Title (中): 形成钛氧化硅的方法
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Application No.: US13323609Application Date: 2011-12-12
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Publication No.: US08399365B2Publication Date: 2013-03-19
- Inventor: Kie Y. Ahn , Leonard Forbes
- Applicant: Kie Y. Ahn , Leonard Forbes
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Schwegman, Lundberg & Woessner, P.A.
- Main IPC: H01L21/31
- IPC: H01L21/31 ; H01L21/469

Abstract:
A dielectric containing a titanium silicon oxide film and a method of fabricating such a dielectric provide a dielectric for use in a variety of electronic devices. Embodiments may include a dielectric containing a titanium silicon oxide film arranged as one or more monolayers. Embodiments may include structures for capacitors, transistors, memory devices, and electronic systems with dielectrics containing a titanium silicon oxide film, and methods for forming such structures.
Public/Granted literature
- US20120088373A1 METHODS OF FORMING TITANIUM SILICON OXIDE Public/Granted day:2012-04-12
Information query
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