Invention Grant
- Patent Title: Adhesive compositions
- Patent Title (中): 粘合剂组合物
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Application No.: US13020069Application Date: 2011-02-03
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Publication No.: US08399544B2Publication Date: 2013-03-19
- Inventor: Daniel F. Varnell , Bryan K. Spraul , Michael A. Evans
- Applicant: Daniel F. Varnell , Bryan K. Spraul , Michael A. Evans
- Applicant Address: US DE Wilmington
- Assignee: Hercules Incorporated
- Current Assignee: Hercules Incorporated
- Current Assignee Address: US DE Wilmington
- Agent Michael J. Herman; Joanne Rossi; Shaorong Chen
- Main IPC: C08L89/00
- IPC: C08L89/00

Abstract:
The invention is directed to composition, preparation and use of composite materials based on an adhesive with solids levels above 45% by weight that contain stable polyamidoamine-epihalohydrin resins (PAE resins) of solids greater than 40% where the relative high solids of the PAE enables the high solids content of the adhesive. Furthermore, at least 45% of the solids portion of the adhesive is made up of a combination of the solids of the PAE resin and the solids of the protein source. The invention is also directed an adhesive comprised of the PAE in combination with a soy protein source. The invention is also directed toward use of the adhesive in composite materials and in particular wood containing composite materials, and more specifically wood fiber or particle based composites.
Public/Granted literature
- US20110190423A1 Adhesive Compositions Public/Granted day:2011-08-04
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