Invention Grant
- Patent Title: Sealable material and method of forming a dielectric weld
- Patent Title (中): 可密封材料和形成电介质焊缝的方法
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Application No.: US12830226Application Date: 2010-07-02
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Publication No.: US08399556B2Publication Date: 2013-03-19
- Inventor: Sridhar Krishnamurthi Siddhamalli , Mark W. Simon , Michael E. Cahill
- Applicant: Sridhar Krishnamurthi Siddhamalli , Mark W. Simon , Michael E. Cahill
- Applicant Address: US OH Aurora
- Assignee: Saint-Gobain Performance Plastics Corporation
- Current Assignee: Saint-Gobain Performance Plastics Corporation
- Current Assignee Address: US OH Aurora
- Agency: Abel Law Group, LLP
- Agent Chi S. Kim
- Main IPC: C08K5/00
- IPC: C08K5/00 ; C08L53/00 ; B32B1/08
Abstract:
A dielectric weldable material includes a blend of at least two components including an inert polymer and an elastomeric polar polymer. A method of forming a bond includes providing a substrate having a first end and a second end, wherein the substrate includes a blend of at least two components including an inert polymer and an elastomeric polar polymer. The method further includes bonding the first end and second end of the substrate with high frequency electromagnetic energy.
Public/Granted literature
- US20110003104A1 SEALABLE MATERIAL AND METHOD OF FORMING A DIELECTRIC WELD Public/Granted day:2011-01-06
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