Invention Grant
- Patent Title: Laser processing system
- Patent Title (中): 激光加工系统
-
Application No.: US13301896Application Date: 2011-11-22
-
Publication No.: US08399803B2Publication Date: 2013-03-19
- Inventor: Mamoru Idaka , Hideki Yamakawa
- Applicant: Mamoru Idaka , Hideki Yamakawa
- Applicant Address: JP Osaka
- Assignee: Keyence Corporation
- Current Assignee: Keyence Corporation
- Current Assignee Address: JP Osaka
- Agency: Kilyk & Bowersox, P.L.L.C.
- Priority: JP2006-204777 20060727
- Main IPC: B23K26/03
- IPC: B23K26/03 ; G06F19/00

Abstract:
A method of setting processing data for a computer-assisted laser processing apparatus is disclosed, along with a system for setting a laser processing data. The method comprises a function of setting a three-dimensional profile of a object and a processing pattern as processing conditions, a function of generating processing data representing the processing conditions for the object, and a function of visually displaying a two dimensional representation of the processing data on a display screen and a function of setting a three-dimensional profile of a object and a processing pattern as processing conditions, wherein it is enabled to set the three-dimensional profile and the processing pattern while displaying the object in two dimensions on the display screen disposed within a processing zone.
Public/Granted literature
Information query
IPC分类: