Invention Grant
- Patent Title: Stage for substrate temperature control apparatus
- Patent Title (中): 基板温度控制装置的阶段
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Application No.: US12596755Application Date: 2008-03-28
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Publication No.: US08399811B2Publication Date: 2013-03-19
- Inventor: Kenichi Bandoh , Katsuo Saio , Kazuhiko Kubota
- Applicant: Kenichi Bandoh , Katsuo Saio , Kazuhiko Kubota
- Applicant Address: JP Tokyo
- Assignee: Komatsu Ltd.
- Current Assignee: Komatsu Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2007-116606 20070426
- International Application: PCT/JP2008/056092 WO 20080328
- International Announcement: WO2008/136228 WO 20081113
- Main IPC: H05B3/68
- IPC: H05B3/68

Abstract:
A stage for a substrate temperature control apparatus having high reliability at low cost by preventing thermal deformation of a plate while employing a material other than ceramics as a material of the plate. The stage is used for mounting a substrate in the substrate temperature control apparatus for controlling a temperature of the substrate, and the stage includes: a plate having a first surface facing the substrate and a second surface opposite to the first surface; and a planar heater bonded to the second surface of the plate, wherein surface treatment is performed in a first thickness on the first surface of the plate, and the surface treatment is performed in a second thickness thinner than the first thickness or no surface treatment is performed on a predetermined area of the second surface of the plate.
Public/Granted literature
- US20100133256A1 STAGE FOR SUBSTRATE TEMPERATURE CONTROL APPARATUS Public/Granted day:2010-06-03
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