Invention Grant
- Patent Title: Semiconductor dies, light-emitting devices, methods of manufacturing and methods of generating multi-wavelength light
- Patent Title (中): 半导体管芯,发光器件,制造方法和产生多波长光的方法
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Application No.: US13149357Application Date: 2011-05-31
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Publication No.: US08399876B2Publication Date: 2013-03-19
- Inventor: Taek Kim
- Applicant: Taek Kim
- Applicant Address: KR Gyeonggi-Do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2010-0051432 20100531
- Main IPC: H01L33/04
- IPC: H01L33/04 ; H01L33/06

Abstract:
A semiconductor die includes at least one first region and at least one second region. The at least one first region is configured to emit light having at least a first wavelength. The at least one second region is configured to emit light having at least a second wavelength, which is different from the first wavelength.
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