Invention Grant
- Patent Title: Light emitting device, method for fabricating light emitting device, light emitting device package, and lighting system
- Patent Title (中): 发光器件,制造发光器件的方法,发光器件封装和照明系统
-
Application No.: US13164471Application Date: 2011-06-20
-
Publication No.: US08399877B2Publication Date: 2013-03-19
- Inventor: Jongpil Jeong
- Applicant: Jongpil Jeong
- Applicant Address: KR Seoul
- Assignee: LG Innotek Co., Ltd.
- Current Assignee: LG Innotek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: KR10-2010-0058781 20100621
- Main IPC: H01L33/04
- IPC: H01L33/04

Abstract:
A light emitting device is provided. The light emitting device includes a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, an active layer disposed between the first conductivity type semiconductor layer and the second conductivity type semiconductor layer and comprising a plurality of well layers and a plurality of barrier layers, a first nitride semiconductor layer disposed between the first conductivity type semiconductor layer and the active layer, and a second nitride semiconductor layer disposed between the active layer and the second conductivity type semiconductor layer, wherein the first nitride semiconductor layer has a higher indium composition than that of at least one of the plurality of well layers.
Public/Granted literature
Information query
IPC分类: