Invention Grant
US08399877B2 Light emitting device, method for fabricating light emitting device, light emitting device package, and lighting system 有权
发光器件,制造发光器件的方法,发光器件封装和照明系统

  • Patent Title: Light emitting device, method for fabricating light emitting device, light emitting device package, and lighting system
  • Patent Title (中): 发光器件,制造发光器件的方法,发光器件封装和照明系统
  • Application No.: US13164471
    Application Date: 2011-06-20
  • Publication No.: US08399877B2
    Publication Date: 2013-03-19
  • Inventor: Jongpil Jeong
  • Applicant: Jongpil Jeong
  • Applicant Address: KR Seoul
  • Assignee: LG Innotek Co., Ltd.
  • Current Assignee: LG Innotek Co., Ltd.
  • Current Assignee Address: KR Seoul
  • Agency: Birch, Stewart, Kolasch & Birch, LLP
  • Priority: KR10-2010-0058781 20100621
  • Main IPC: H01L33/04
  • IPC: H01L33/04
Light emitting device, method for fabricating light emitting device, light emitting device package, and lighting system
Abstract:
A light emitting device is provided. The light emitting device includes a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, an active layer disposed between the first conductivity type semiconductor layer and the second conductivity type semiconductor layer and comprising a plurality of well layers and a plurality of barrier layers, a first nitride semiconductor layer disposed between the first conductivity type semiconductor layer and the active layer, and a second nitride semiconductor layer disposed between the active layer and the second conductivity type semiconductor layer, wherein the first nitride semiconductor layer has a higher indium composition than that of at least one of the plurality of well layers.
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