Invention Grant
- Patent Title: Tuning the efficiency in the transmission of radio-frequency signals using micro-bumps
- Patent Title (中): 调整使用微型突起传播射频信号的效率
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Application No.: US12974896Application Date: 2010-12-21
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Publication No.: US08399961B2Publication Date: 2013-03-19
- Inventor: Hsiao-Tsung Yen , Yu-Ling Lin , Cheng Hung Lee , Chin-Wei Kuo , Ho-Hsiang Chen , Min-Chie Jeng
- Applicant: Hsiao-Tsung Yen , Yu-Ling Lin , Cheng Hung Lee , Chin-Wei Kuo , Ho-Hsiang Chen , Min-Chie Jeng
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L27/08
- IPC: H01L27/08
Abstract:
A device includes a die including a main circuit and a first pad coupled to the main circuit. A work piece including a second pad is bonded to the die. A first plurality of micro-bumps is electrically coupled in series between the first and the second pads. Each of the plurality of micro-bumps includes a first end joining the die and a second end joining the work piece. A micro-bump is bonded to the die and the work piece. The second pad is electrically coupled to the micro-bump.
Public/Granted literature
- US20120153433A1 Tuning the Efficiency in the Transmission of Radio-Frequency Signals Using Micro-Bumps Public/Granted day:2012-06-21
Information query
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