A semiconductor chip of the present invention is a semiconductor device that includes a hexagonal semiconductor layer having anisotropic mechanical properties. A semiconductor chip (21), when viewed from a direction perpendicular to the semiconductor chip (21), has a rectangular shape that has a first side (1A) and a second side (1B) orthogonal to the first side (1A). The amount of thermal deformation along a direction in which the first side (1A) extends and the amount of thermal deformation along a direction in which the second side (1B) extends are substantially equal to each other.