A stacked semiconductor package includes a substrate having an upper surface and a lower surface, and divided into a first region and a second region that adjoins the first region; a support member formed in the second region on the upper surface of the substrate; and a semiconductor chip module including a plurality of semiconductor chips each of which is bent and has bonding pads near one lower edge of a declining slope of a first surface thereof and which are stacked on the support member in a step-like shape such that their bonding pads face the first region and are electrically connected with the substrate.