Invention Grant
- Patent Title: Resin sealed semiconductor device and manufacturing method therefor
- Patent Title (中): 树脂密封半导体器件及其制造方法
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Application No.: US12247515Application Date: 2008-10-08
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Publication No.: US08399976B2Publication Date: 2013-03-19
- Inventor: Masafumi Matsumoto , Tatsuya Iwasa , Junji Yamada , Masaru Furukawa
- Applicant: Masafumi Matsumoto , Tatsuya Iwasa , Junji Yamada , Masaru Furukawa
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2008-046390 20080227
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/00
Abstract:
A semiconductor device includes a thermoplastic resin case, a semiconductor chip mounted within the thermoplastic resin case, a metal terminal having a wire bonding surface and an opposing contact surface, and a wire connected between the wire bonding surface and the semiconductor chip. The contact surface of the metal terminal is thermoplastically bonded at an area to the inside of the thermoplastic resin case.
Public/Granted literature
- US20090212411A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR Public/Granted day:2009-08-27
Information query
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