An embedded package includes a first semiconductor chip having a first conductive line which has a first sunken area, a second semiconductor chip having a second conductive line which has a second sunken area, wherein the first semiconductor chip and the second semiconductor chip are arranged facing each other, and wherein the first sunken area and the second sunken area are arranged facing each other, a core layer surrounding the first semiconductor chip and the second semiconductor chip, wherein the core layer has a first circuit pattern coupled to an external terminal; and a bump formed in the first and second sunken areas, wherein the bump is coupled to the first circuit pattern.