Invention Grant
- Patent Title: Chip carrier
- Patent Title (中): 芯片载体
-
Application No.: US13204051Application Date: 2011-08-05
-
Publication No.: US08399996B2Publication Date: 2013-03-19
- Inventor: Khalil Hosseini , Joachim Mahler
- Applicant: Khalil Hosseini , Joachim Mahler
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater & Matsil, L.L.P.
- Priority: DE102006023998 20060522
- Main IPC: H01L23/498
- IPC: H01L23/498
Abstract:
Electronic circuit arrangement, includes a chip and a chip carrier having a substrate and a chip contact location. At least the chip contact location is provided with a soldering layer. The chip includes a bonding layer. A silver layer for eutectic bonding with the bonding layer is provided on the soldering layer in the region of the chip contact location.
Public/Granted literature
- US20110285033A1 Chip Carrier Public/Granted day:2011-11-24
Information query
IPC分类:
