Invention Grant
- Patent Title: Power package including multiple semiconductor devices
- Patent Title (中): 功率封装包括多个半导体器件
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Application No.: US13158244Application Date: 2011-06-10
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Publication No.: US08399997B2Publication Date: 2013-03-19
- Inventor: Jiangyuan Zhang , Elite Lee , Dana Liu
- Applicant: Jiangyuan Zhang , Elite Lee , Dana Liu
- Applicant Address: CN Shanghai
- Assignee: Shanghai Kalhong Electronic Company Limited
- Current Assignee: Shanghai Kalhong Electronic Company Limited
- Current Assignee Address: CN Shanghai
- Agent Yingsheng Tung
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
In one embodiment, a method includes attaching a film to cover a first portion of a first semiconductor die. The first semiconductor die is attached, using the tape, to a lead frame using a first bonding method. The first bonding method places the film between the lead frame and the semiconductor die. A second semiconductor die is attached to the lead frame using a second bonding method. The second bonding method bonds the lead frame and the semiconductor die. The first semiconductor device and the second semiconductor device are encapsulated into a semiconductor package.
Public/Granted literature
- US20120313232A1 Power Package Including Multiple Semiconductor Devices Public/Granted day:2012-12-13
Information query
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