Invention Grant
- Patent Title: Semiconductor package requiring reduced manufacturing processes
- Patent Title (中): 需要减少制造工艺的半导体封装
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Application No.: US12604601Application Date: 2009-10-23
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Publication No.: US08399998B2Publication Date: 2013-03-19
- Inventor: Ki Young Kim , Sung Ho Hyun , Myung Geun Park , Woong Sun Lee
- Applicant: Ki Young Kim , Sung Ho Hyun , Myung Geun Park , Woong Sun Lee
- Applicant Address: KR Gyeonggi-do
- Assignee: Hynix Semiconductor Inc.
- Current Assignee: Hynix Semiconductor Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Ladas & Parry LLP
- Priority: KR10-2009-0073509 20090810
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A semiconductor package includes a semiconductor chip having a first surface, a second surface located opposite the first surface, and side surfaces connecting the first and second surfaces. The semiconductor chip includes bonding pads disposed on the first surface and having a molding member formed to cover the first surface of the semiconductor chip. The molding member is formed so as to expose the side surfaces of the semiconductor chip. The semiconductor chip also includes bonding members having first ends electrically connected to the respective bonding pads and second ends that are connected to and opposite the first ends. The second ends are exposed from side surfaces of the molding member after passing through the molding member so as to allow various electrical connections.
Public/Granted literature
- US20110031604A1 SEMICONDUCTOR PACKAGE REQUIRING REDUCED MANUFACTURING PROCESSES Public/Granted day:2011-02-10
Information query
IPC分类:
