A field emission cathode device includes a substrate, a metal plate attached to the substrate, at least one electron emitter electrical connected with the metal plate, and a filler. The metal plate defines at least one through hole extending through the metal plate. The at least one electron emitter is fixed between the substrate and the metal plate and extends through the at least one through hole. The filler is filled into the at least one through hole to fix the at least one electron emitter.