Invention Grant
- Patent Title: Coupled-loop chip antenna
- Patent Title (中): 耦合芯片天线
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Application No.: US12355147Application Date: 2009-01-16
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Publication No.: US08400360B2Publication Date: 2013-03-19
- Inventor: Yueh-Lin Tsai , Meng Hsueh Tsai , Chin Huang Cheng
- Applicant: Yueh-Lin Tsai , Meng Hsueh Tsai , Chin Huang Cheng
- Applicant Address: TW
- Assignee: Inpaq Technology Co., Ltd.
- Current Assignee: Inpaq Technology Co., Ltd.
- Current Assignee Address: TW
- Agency: Seyfarth Shaw, LLP
- Priority: TW97125755A 20080708
- Main IPC: H01Q1/38
- IPC: H01Q1/38

Abstract:
A loop antenna for communication is provided, which includes a microwave substrate, being a hexahedron; a first conductive layer, disposed on an upper surface of the substrate for forming a first loop; a second conductive layer, disposed on a first side surface of the substrate, and electrically connected to a feed-in point and a ground point; and a third conductive layer, disposed on a lower surface of the substrate for forming a second loop. The first conductive layer and the second conductive layer are electrically connected at the junction between the upper surface and the first side surface, and the second conductive layer and the third conductive layer are electrically connected at the junction between the first side surface and the lower surface. The antenna also has an appropriate bandwidth for wireless communication application.
Public/Granted literature
- US20100007575A1 COUPLED-LOOP CHIP ANTENNA Public/Granted day:2010-01-14
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