Invention Grant
US08401693B2 Method and manipulator gripper for spacing bundles of a bundle layer
有权
用于间隔束束层的方法和操纵器夹持器
- Patent Title: Method and manipulator gripper for spacing bundles of a bundle layer
- Patent Title (中): 用于间隔束束层的方法和操纵器夹持器
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Application No.: US12715514Application Date: 2010-03-02
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Publication No.: US08401693B2Publication Date: 2013-03-19
- Inventor: Michael Baumann
- Applicant: Michael Baumann
- Applicant Address: DE Augsburg
- Assignee: Kuka Roboter GmbH
- Current Assignee: Kuka Roboter GmbH
- Current Assignee Address: DE Augsburg
- Agency: Schiff Hardin LLP
- Priority: DE102009011299 20090302
- Main IPC: G06F7/00
- IPC: G06F7/00 ; G06F19/00 ; B65G57/22 ; B65G61/00
Abstract:
In a method for spacing bundles of a bundle layer by means of a manipulator gripper with at least one support base that engages bundles and a stop for the placement of bundles, separation between an edge of the support base and the stop is reduced, by a placement motion of the support base in a placement direction that is superimposed on the relative motion of the support base and the stop and is synchronized with this relative motion.
Public/Granted literature
- US20100249984A1 METHOD AND MANIPULATOR GRIPPER FOR SPACING BUNDLES OF A BUNDLE LAYER Public/Granted day:2010-09-30
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