Invention Grant
- Patent Title: Reducing through process delay variation in metal wires
- Patent Title (中): 通过金属线中的工艺延迟变化减少
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Application No.: US13157909Application Date: 2011-06-10
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Publication No.: US08402398B2Publication Date: 2013-03-19
- Inventor: Kanak B. Agarwal , Shayak Banerjee , Sani R. Nassif
- Applicant: Kanak B. Agarwal , Shayak Banerjee , Sani R. Nassif
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Stephen R. Tkacs; Stephen J. Walder, Jr.; Eustus D. Nelson
- Main IPC: G06F17/50
- IPC: G06F17/50 ; G06F9/455

Abstract:
A mechanism is provided for reducing through process delay variation in metal wires by layout retargeting. The mechanism performs initial retargeting, decomposition, and resolution enhancement techniques. For example, the mechanism may perform optical proximity correction. The mechanism then performs lithographic simulation and optical rules checking. The mechanism provides retargeting rules developed based on coupling lithography simulation and resistance/capacitance (RC) extraction. The mechanism performs RC extraction to capture non-linear dependency of RC on design shape dimensions. If the electrical properties in the lithographic simulation are within predefined specifications, the mechanism accepts the retargeting rules; however, if the electrical properties from RC extraction are outside the predefined specifications, the mechanism modifies the retargeting rules and repeats resolution enhancement techniques.
Public/Granted literature
- US20120317523A1 Reducing Through Process Delay Variation in Metal Wires Public/Granted day:2012-12-13
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