Invention Grant
- Patent Title: Method of manufacturing hollow microneedle structures
- Patent Title (中): 制造中空微针结构的方法
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Application No.: US12635480Application Date: 2009-12-10
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Publication No.: US08402629B2Publication Date: 2013-03-26
- Inventor: Dae Sik Lee , Yong Sun Yoon , Moon Youn Jung , Seon Hee Park
- Applicant: Dae Sik Lee , Yong Sun Yoon , Moon Youn Jung , Seon Hee Park
- Applicant Address: KR Daejeon
- Assignee: Electronics and Telecommunications Research Institute
- Current Assignee: Electronics and Telecommunications Research Institute
- Current Assignee Address: KR Daejeon
- Priority: KR10-2009-0061620 20090707
- Main IPC: B23P25/00
- IPC: B23P25/00 ; B22D11/126 ; A61M5/32 ; B05D3/12

Abstract:
Provided is a method of manufacturing a hollow microneedle structure. The method includes coating a hollow core having a predetermined section and being long in a lengthwise direction with a coating solution, and solidifying the coating solution to form a coating layer, depositing a metal seed layer on the coating layer, plating the seed metal layer with a metal to form a plated layer, cutting the hollow core having the plated layer at an inclination angle with respect to the lengthwise direction for form a surface inclination, and removing the hollow core and the coating layer to form a hollow microneedle structure. Thus, the hollow microneedle structure can be manufactured to have such diameter, length, hardness, and inclination angle as to minimize pain. By use of the hollow core, the microneedle structure can have vertical microneedles with a uniform inner diameter.
Public/Granted literature
- US20110005669A1 METHOD OF MANUFACTURING HOLLOW MICRONEEDLE STRUCTURES Public/Granted day:2011-01-13
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