Invention Grant
- Patent Title: Enclosure with flange
- Patent Title (中): 外壳与法兰
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Application No.: US12728390Application Date: 2010-03-22
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Publication No.: US08403171B2Publication Date: 2013-03-26
- Inventor: Tsun-Hsien Chou , Chung-Cheng Hsieh , Li-Ping Chen
- Applicant: Tsun-Hsien Chou , Chung-Cheng Hsieh , Li-Ping Chen
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN200920315675U 20091125
- Main IPC: B65D6/40
- IPC: B65D6/40

Abstract:
An enclosure includes a bottom panel and a side panel extending from the bottom panel. The side panel is substantially perpendicular to the bottom panel. The side panel has an opening and a flange surrounding the opening. A cross section of the flange includes a first side portion, a bent portion extending from the first side portion, and a second side portion. An angle is defined by the second side portion and the side panel is larger than 90 degrees. The flange is configured to prevent the opening to be deformed.
Public/Granted literature
- US20110121005A1 ENCLOSURE WITH FLANGE Public/Granted day:2011-05-26
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