Invention Grant
- Patent Title: Semiconductor integrated circuit device and IC card mounting same
- Patent Title (中): 半导体集成电路器件和IC卡安装相同
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Application No.: US13260303Application Date: 2010-03-31
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Publication No.: US08403233B2Publication Date: 2013-03-26
- Inventor: Kazuki Watanabe , Akihiro Toriyama
- Applicant: Kazuki Watanabe , Akihiro Toriyama
- Applicant Address: JP Kawasaki-shi
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kawasaki-shi
- Agency: Miles and Stockbridge P.C.
- Priority: JP2009-098745 20090415
- International Application: PCT/JP2010/055834 WO 20100331
- International Announcement: WO2010/119772 WO 20101021
- Main IPC: G06K19/06
- IPC: G06K19/06

Abstract:
In an IC card, even when undershoot or overshoot which occurs upon an amplitude change by communication data is large, the change is accurately detected. A semiconductor device has antenna terminals, a power supply circuit for generating power supply voltage from an AC signal supplied to the antenna terminals, and a receiver circuit for demodulating an information signal superimposed on the AC signal. The receiver circuit includes a rectifier circuit, a filter circuit, a capacitor, an amplifier, a feedback path, a switch circuit, a binarizing circuit, and a control circuit. An output of the amplifier is transmitted to an inverting input terminal thereof, and the switch circuit is controlled by an output of the control circuit. In a predetermined period since level changes of an output of the binarizing circuit, the switch circuit is controlled to an off state by the output of the control circuit.
Public/Granted literature
- US20120006905A1 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND IC CARD MOUNTING SAME Public/Granted day:2012-01-12
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