Invention Grant
- Patent Title: Liquid ejection head with nozzle plate heater
- Patent Title (中): 带喷嘴板加热器的液体喷头
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Application No.: US13081198Application Date: 2011-04-06
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Publication No.: US08403450B2Publication Date: 2013-03-26
- Inventor: Masahiko Sato , Hiroyuki Hagiwara , Haruhisa Uezawa
- Applicant: Masahiko Sato , Hiroyuki Hagiwara , Haruhisa Uezawa
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: JP2010-147248 20100629
- Main IPC: B41J29/38
- IPC: B41J29/38

Abstract:
A liquid ejection head including: a flow channel unit including a nozzle plate, and a flow-channel-containing substrate (FCC), the nozzle plate and the FCC being laminated, a head case formed with a common liquid flow channel configured to supply the liquid to the reservoir and joined to the FCC on the side opposite from the nozzle plate; a heater configured to heat the nozzle plate; a head cover heated by the heater and formed with a bottom surface portion opposing the nozzle plate on the side opposite from the head case, wherein a distal end of the head cover comes into abutment with a portion between an area of the nozzle plate corresponding to the reservoir and an area formed with the nozzle row, and a void is formed between the area of the nozzle plate corresponding to the reservoir and the head cover.
Public/Granted literature
- US20110316935A1 LIQUID EJECTION HEAD Public/Granted day:2011-12-29
Information query
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