Invention Grant
- Patent Title: Liquid ejecting head and manufacturing method thereof, and liquid ejecting apparatus
- Patent Title (中): 液体喷射头及其制造方法和液体喷射装置
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Application No.: US12705496Application Date: 2010-02-12
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Publication No.: US08403464B2Publication Date: 2013-03-26
- Inventor: Munehide Kanaya
- Applicant: Munehide Kanaya
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: JP2009-032360 20090216
- Main IPC: B41J2/175
- IPC: B41J2/175

Abstract:
A liquid ejecting head includes a first flow channel member that configures part of the wall surface of a liquid flow channel, a second flow channel member that configures a different part of the wall surface of the liquid flow channel than the part configured by the first flow channel member, and an integral molded member, formed around the liquid flow channel, that joins the first flow channel member with the second flow channel member through integral molding. An elastic member that is sandwiched between the first flow channel member and the second flow channel member and is more elastically deformable than the first flow channel member and the second flow channel member, is provided around the liquid flow channel, and the integral molded member is formed on the outside of the elastic member sandwiched between the first flow channel member and the second flow channel member.
Public/Granted literature
- US20100208009A1 LIQUID EJECTING HEAD AND MANUFACTURING METHOD THEREOF, AND LIQUID EJECTING APPARATUS Public/Granted day:2010-08-19
Information query
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