Invention Grant
- Patent Title: Substrate transfer apparatus and substrate treatment system
- Patent Title (中): 基板转印装置和基板处理系统
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Application No.: US12656324Application Date: 2010-01-26
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Publication No.: US08403601B2Publication Date: 2013-03-26
- Inventor: Mitsuteru Yano , Yuichi Douki , Hiroshi Tomita
- Applicant: Mitsuteru Yano , Yuichi Douki , Hiroshi Tomita
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Posz Law Group, PLC
- Priority: JP2009-035579 20090218
- Main IPC: B65G53/40
- IPC: B65G53/40
Abstract:
The present invention is a transfer apparatus for a substrate, including a substrate housing container housing a substrate therein and having a transfer-in/out port for the substrate formed in a side surface thereof; a gas jet unit jetting a predetermined gas toward a rear surface of the substrate in the substrate housing container; and a control unit regulating a supply amount of the predetermined gas supplied from the gas jet unit to control the substrate in the substrate housing container to a predetermined height.
Public/Granted literature
- US20100211215A1 Substrate transfer apparatus and substrate treatment system Public/Granted day:2010-08-19
Information query
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