Invention Grant
- Patent Title: High speed substrate aligner apparatus
- Patent Title (中): 高速基板对准器
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Application No.: US13030926Application Date: 2011-02-18
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Publication No.: US08403619B2Publication Date: 2013-03-26
- Inventor: Jairo Terra Moura , Martin Hosek , Todd Bottomley , Ulysses Gilchrist
- Applicant: Jairo Terra Moura , Martin Hosek , Todd Bottomley , Ulysses Gilchrist
- Applicant Address: US MA Chelmsford
- Assignee: Brooks Automation, Inc.
- Current Assignee: Brooks Automation, Inc.
- Current Assignee Address: US MA Chelmsford
- Agency: Perman & Green, LLP
- Agent Colin C. Durham
- Main IPC: H01L21/68
- IPC: H01L21/68
Abstract:
In accordance to an exemplary embodiment of the disclosed embodiments, a substrate aligner apparatus is presented, the substrate aligner apparatus having a frame adapted to allow a substrate transporter to transport a substrate to and from the aligner apparatus, an inverted chuck capable of holding the substrate and movably connected to the frame by a chuck driveshaft engaged to the inverted chuck for moving the inverted chuck relative to the frame and effecting alignment of the substrate, a sensing device located between the chuck and chuck driveshaft for detecting a position determining feature of the substrate, and a substrate transfer mechanism movably connected to the frame and located inside the frame below the inverted chuck for moving the substrate from the inverted chuck to the substrate transporter.
Public/Granted literature
- US20120045300A1 HIGH SPEED SUBSTRATE ALIGNER APPARATUS Public/Granted day:2012-02-23
Information query
IPC分类:
