Invention Grant
- Patent Title: Cable assembly with an improved grounding device
- Patent Title (中): 电缆组件具有改进的接地装置
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Application No.: US13297205Application Date: 2011-11-15
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Publication No.: US08403698B2Publication Date: 2013-03-26
- Inventor: Ping-Sheng Su , Fan-Bo Meng , Qing Wang
- Applicant: Ping-Sheng Su , Fan-Bo Meng , Qing Wang
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agent Wei Te Chung; Ming Chieh Chang
- Main IPC: H01R13/56
- IPC: H01R13/56

Abstract:
A cable assembly, comprising a housing, a plurality of conductive terminals received in the housing; a metal shell enclosing the housing; a cable electrically connected to the conductive terminals and a foil. The cable has a number of wires, a braided layer enclosing the wires and an outer insulative pin enclosing the braided layer, each wire has a conductor and an inner insulative pin enclosing the conductor, the braided layer is turned back and encloses a surface of the outer insulative pin. The foil encloses the braided layer which is turned back, and is sandwiched in the metal shell.
Public/Granted literature
- US20120122334A1 CABLE ASSEMBLY WITH AN IMPROVED GRONDING DEVICE Public/Granted day:2012-05-17
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