Invention Grant
US08404071B2 Rapid film bonding using pattern printed adhesive 有权
使用图案印刷胶粘剂快速胶合

Rapid film bonding using pattern printed adhesive
Abstract:
Various processes for the creation of a film to film bond using printed patterns of adhesive traces. In some implementations of the process, control of the process including control of the temperature of the adhesive and film to a temperature approaching the heat distortion temperature for the film will vary the strength of the bond from a frangible bond to a bond the tears the film, (a film-tearing bond). Some implementations of the process may be used to produce bonded films at web speed rates that are significantly higher than commercial rates for heat seal processes.
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