A resist layer is formed over one surface of a current-collector material, while a resist layer having a predetermined pattern is formed on the other surface of the current-collector material. Through-holes are formed on the current-collector material through an etching process. An electrode slurry is applied onto the current-collector material formed with the through-holes without removing the resist layers. Specifically, since the through-holes are closed by the resist layer, the electrode slurry does not pass through the through-holes to leak out. Therefore, the current-collector material can be conveyed in the horizontal direction, whereby the productivity of an electrode can be enhanced. The resist layers are made of PVdF, and the resist layers are removed in a heating and drying step in which the PVdF is dissolved.