Invention Grant
- Patent Title: Honeycomb structure
- Patent Title (中): 蜂窝结构
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Application No.: US12476296Application Date: 2009-06-02
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Publication No.: US08404327B2Publication Date: 2013-03-26
- Inventor: Fumiharu Sato , Takuya Hiramatsu , Shuichi Ichikawa
- Applicant: Fumiharu Sato , Takuya Hiramatsu , Shuichi Ichikawa
- Applicant Address: JP Nagoya
- Assignee: NGK Insulators, Ltd.
- Current Assignee: NGK Insulators, Ltd.
- Current Assignee Address: JP Nagoya
- Agency: Oliff & Berridge, PLC
- Priority: JP2008-174845 20080703
- Main IPC: B32B3/12
- IPC: B32B3/12

Abstract:
A honeycomb structure includes: a periphery-ground article obtained by grinding an outer peripheral portion of a cell structure 3 where honeycomb segments 11 are bonded by a bonding layer 12 at an outer wall 10 of each of them, and an outer peripheral coat layer 9 disposed on an outer peripheral face 8 of the periphery-ground article; wherein at least one of the bonding layer 12 and the outer peripheral coat layer 9 is formed using honeycomb-forming slurry containing biologically soluble fibers containing a metal oxide capable of extricating a metal ion and an inorganic binder containing a colloidal oxide having modified silica sol manufactured by adding a substance containing amine or an aqueous solution of a water-soluble metalate of an amphoteric metal to silica sol. Crack generation of the outer peripheral coat layer and/or deterioration of bonding strength of the bonding layer can be inhibited.
Public/Granted literature
- US20100003453A1 HONEYCOMB STRUCTURE Public/Granted day:2010-01-07
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