Invention Grant
- Patent Title: Laminated film and molded body
- Patent Title (中): 层压膜和成型体
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Application No.: US13342284Application Date: 2012-01-03
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Publication No.: US08404335B2Publication Date: 2013-03-26
- Inventor: Syunichi Osada , Wataru Gouda
- Applicant: Syunichi Osada , Wataru Gouda
- Applicant Address: JP
- Assignee: Toray Industries, Inc.
- Current Assignee: Toray Industries, Inc.
- Current Assignee Address: JP
- Agency: DLA Piper LLP (US)
- Priority: JP2005-237497 20050818
- Main IPC: B32B7/00
- IPC: B32B7/00 ; B32B27/06 ; B32B27/08

Abstract:
A laminated film includes a structure where each 200 layers or more of a layer composed of a resin A (A layer) and a layer composed of a resin B (B layer) are alternately laminated, wherein a relative reflectance in a wavelength range of 400 nm to 1000 nm is 30% or more, tensile stresses at 100% elongation in a longitudinal direction and a width direction of the film are 3 MPa or more and 90 MPa or less in a tensile test at 150° C., and the number of layers with a layer pair-thickness of 120 nm or more and less than 220 nm is 1.05 times or more to 2.5 times or less the number of layers with a layer-thickness of 220 nm or more and 320 nm or less.
Public/Granted literature
- US20120097427A1 LAMINATED FILM AND MOLDED BODY Public/Granted day:2012-04-26
Information query