Invention Grant
- Patent Title: Hermetic high temperature dielectric with groove and thermal expansion compensator
- Patent Title (中): 密封高温电介质带槽和热膨胀补偿器
-
Application No.: US12461413Application Date: 2009-08-11
-
Publication No.: US08404398B2Publication Date: 2013-03-26
- Inventor: Martin Perry , Michael Petrucha , Andy Ta , Brandon Snow
- Applicant: Martin Perry , Michael Petrucha , Andy Ta , Brandon Snow
- Applicant Address: US CA Sunnyvale
- Assignee: Bloom Energy Corporation
- Current Assignee: Bloom Energy Corporation
- Current Assignee Address: US CA Sunnyvale
- Agency: The Marbury Law Group PLLC
- Main IPC: H01M2/08
- IPC: H01M2/08 ; H01M2/40

Abstract:
According to an embodiment, a gas delivery device for a fuel cell system includes a hollow ceramic element comprising a dielectric material having at least one groove in one end face of the ceramic element and a first metal tube, wherein an end of the first metal tube is inserted into the groove of the hollow ceramic element. According to an embodiment, a fuel cell system includes a fuel cell stack or column, a gas delivery line fluidly connected to the stack or column, and a coefficient of thermal expansion compensator/isolator located in the gas delivery line, where the coefficient of thermal expansion compensator/isolator includes a hollow ceramic element made of a dielectric material having at least one groove in one end face of the ceramic element, a first metal tube, where an end of the first metal tube is inserted into the groove of the hollow ceramic element, and a hollow flexible element which compensates for differences in coefficients of thermal expansion between components of the fuel cell system.
Public/Granted literature
- US20100040934A1 Hermetic high temperature dielectric with groove and thermal expansion compensator Public/Granted day:2010-02-18
Information query