Invention Grant
- Patent Title: Water-barrier encapsulation method
- Patent Title (中): 防水封装方法
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Application No.: US13117947Application Date: 2011-05-27
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Publication No.: US08404502B2Publication Date: 2013-03-26
- Inventor: Tae K. Won , Jose Manuel Dieguez Campo , John M. White , Sanjay Yadav
- Applicant: Tae K. Won , Jose Manuel Dieguez Campo , John M. White , Sanjay Yadav
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson & Sheridan, LLP
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L33/00
Abstract:
The present invention generally relates to organic light emitting diode (OLED) structures and methods for their manufacture. To increase the lifetime of an OLED structure, an encapsulating layer may be deposited over the OLED structure. The encapsulating layer may fully enclose or “encapsulate” the OLED structure. The encapsulating layer may have a substantially planar surface opposite to the interface between the OLED structure and the encapsulating layer. The planar surface permits successive layers to be evenly deposited over the OLED structure. The encapsulating layer reduces any oxygen penetration into the OLED structure and may increase the lifetime of the OLED structure.
Public/Granted literature
- US20110297921A1 WATER-BARRIER ENCAPSULATION METHOD Public/Granted day:2011-12-08
Information query
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