Invention Grant
US08404519B2 Process that includes assembling together first and second substrates the have respective first and second carbon nanotube arrays with geometrically complementary patterns
有权
包括将第一和第二基底组装在一起的方法具有具有几何互补图案的相应的第一和第二碳纳米管阵列
- Patent Title: Process that includes assembling together first and second substrates the have respective first and second carbon nanotube arrays with geometrically complementary patterns
- Patent Title (中): 包括将第一和第二基底组装在一起的方法具有具有几何互补图案的相应的第一和第二碳纳米管阵列
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Application No.: US13108707Application Date: 2011-05-16
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Publication No.: US08404519B2Publication Date: 2013-03-26
- Inventor: Gregory M. Chrysler , Thomas S. Dory , James G. Maveety , Edward Prack , Unnikrishnan Vadakkanmaruveedu
- Applicant: Gregory M. Chrysler , Thomas S. Dory , James G. Maveety , Edward Prack , Unnikrishnan Vadakkanmaruveedu
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Winkle, PLLC
- Main IPC: H01L21/58
- IPC: H01L21/58
Abstract:
A carbon nanotube (CNT) array is patterned on a substrate. The substrate can be a microelectronic die or a heat sink for a die. The patterned CNT array is patterned by using a patterned catalyst on the substrate to form the CNT array by growing. The patterned CNT array can also be patterned by using a patterned mask on the substrate to form the CNT array by growing. A computing system that uses the CNT array for heat transfer from the die is also used.
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