Invention Grant
US08404522B2 Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device
有权
用于半导体背面的切割带集成膜，以及用于制造半导体器件的工艺
- Patent Title: Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device
- Patent Title (中): 用于半导体背面的切割带集成膜，以及用于制造半导体器件的工艺
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Application No.: US13172945Application Date: 2011-06-30
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Publication No.: US08404522B2Publication Date: 2013-03-26
- Inventor: Goji Shiga , Naohide Takamoto , Fumiteru Asai
- Applicant: Goji Shiga , Naohide Takamoto , Fumiteru Asai
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Sughrue Mion, PLLC
- Priority: JP2010-170933 20100729
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
The present invention relates to a dicing tape-integrated film for semiconductor back surface including: a dicing tape including a base material and a pressure-sensitive adhesive layer laminated in this order, and a film for semiconductor back surface provided on the pressure-sensitive adhesive layer of the dicing tape, where the pressure-sensitive adhesive layer has a thickness of from 20 μm to 40 μm.
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Information query
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