Invention Grant
US08404568B2 Systems and methods for fabricating an out-of-plane MEMS structure
有权
用于制造平面外MEMS结构的系统和方法
- Patent Title: Systems and methods for fabricating an out-of-plane MEMS structure
- Patent Title (中): 用于制造平面外MEMS结构的系统和方法
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Application No.: US12163277Application Date: 2008-06-27
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Publication No.: US08404568B2Publication Date: 2013-03-26
- Inventor: Michael Foster , Shifang Zhou
- Applicant: Michael Foster , Shifang Zhou
- Applicant Address: US NJ Morristown
- Assignee: Honeywell International Inc.
- Current Assignee: Honeywell International Inc.
- Current Assignee Address: US NJ Morristown
- Agency: Lowe Graham Jones PLLC
- Main IPC: H01L21/326
- IPC: H01L21/326
Abstract:
System and methods offset mechanism elements during fabrication of Micro-Electro-Mechanical Systems (MEMS) devices. An exemplary embodiment applies a voltage across an offset mechanism element and a bonding layer of a MEMS device to generate an electrostatic charge between the offset mechanism element and the bonding layer, wherein the electrostatic charge draws the offset mechanism element to the bonding layer. The offset mechanism element and the bonding layer are then bonded.
Public/Granted literature
- US20090321008A1 SYSTEMS AND METHODS FOR FABRICATING AN OUT-OF-PLANE MEMS STRUCTURE Public/Granted day:2009-12-31
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