Invention Grant
- Patent Title: Film deposition method
- Patent Title (中): 膜沉积法
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Application No.: US13000835Application Date: 2009-06-25
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Publication No.: US08404571B2Publication Date: 2013-03-26
- Inventor: Shin Hashimoto , Tatsuya Tanabe
- Applicant: Shin Hashimoto , Tatsuya Tanabe
- Applicant Address: JP Osaka-shi
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka-shi
- Agency: Venable LLP
- Agent Michael A. Sartori; Tamatane J. Aga
- Priority: JP2008-168597 20080627
- International Application: PCT/JP2009/061633 WO 20090625
- International Announcement: WO2009/157514 WO 20091230
- Main IPC: H01L21/02
- IPC: H01L21/02 ; C23C16/30 ; C30B25/02 ; C30B29/40

Abstract:
Provided is a film deposition method capable of improving the crystal characteristic near an interface according to the lattice constant of a material that will constitute a thin film to be deposited. Specifically, a substrate is curved relative to the direction along one main surface on which the thin film is to be deposited, according to the lattice constant the material that will constitute the thin film to be deposited and the lattice constant of a material constituting the one main surface. The thin film is deposited on the one main surface of the substrate with the substrate curved.
Public/Granted literature
- US20110097880A1 FILM DEPOSITION METHOD Public/Granted day:2011-04-28
Information query
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